Deep data for faster silicon bring-up, characterization, and qualification with higher confidence
TimeTuesday, December 7th4:30pm - 5:30pm PST
LocationDAC Pavilion
Event Type
Designer, IP and Embedded Systems Track Presentations
Virtual Programs
Presented In-Person
DescriptionThe process of reaching volume production entails many challenges and uncertainties, especially as design complexities and process technologies advance. Designers work diligently with product engineers to characterize, qualify and validate products, while dealing with pressures of time-to-market, performance competitiveness, and quality and reliability requirements. A shift to deep data is needed to overcome the limitations of best-known-methods, providing visibility into the parametric health and behavior of ICs at every stage. This presentation will highlight how advanced analytics based on chip telemetry allows for advanced post-to-pre silicon correlation, enhanced reliability validation, performance correlation of ATE and application/system testing, and safe and accurate limit-setting for volume manufacturing. Chip manufacturers gain accelerated product bring-up at greater levels of certainty.