Multi-Physics Simulation Techniques toward Electromagnetic Side-Channel Attack Assessments on IC Chip Assembly
TimeWednesday, December 8th5:00pm - 6:00pm PST
LocationLevel 2 - Exhibit Hall
Event Type
Designer, IP and Embedded Systems Track Poster Networking Reception
Virtual Programs
Presented In-Person
DescriptionElectromagnetic (EM) emission from IC chips carries secret information of cryptographic processing because EM side channel leakage directly related with power current consumption during the operation of crypto ICs. Simulation-based EM side-channel analysis provides flexible design-time optimization opportunities. In this work, a multi-physics EM side-channel simulation technique is embodied with dynamic power current modeling tools and EM field solvers. This technique makes it possible to analyze chip near-field location in three-dimension and specify the most critical location and sensitive parameters to apply design countermeasures.