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Presentation

Enhanced Hyperscaling of Data Centers using In-Chip Monitoring & Sensing Fabrics
TimeWednesday, December 8th5:00pm - 6:00pm PST
LocationLevel 2 - Exhibit Hall
Event Type
Designer, IP and Embedded Systems Track Poster Networking Reception
Virtual Programs
Presented In-Person
DescriptionThe development of High Performance Computing (HPC) chips on a large scale for datacentre platforms poses many challenges associated with multi-processor architectures working on high computational workloads. This presentation explores the interplay between thermal management, power distribution, processing performance and reliable service provision at the micro level and how it can impact the decisions made when building extensive computing infrastructures. By applying key approaches through the deployment of embedded sensing fabrics, benefits include enhanced reliability of operation as well as dynamic power and speed optimisation. Such schemes allow for the hyper-scaling of datacentres and create new possibilities for in-field analytics.