How System Companies are Re-shaping requirements for EDA
TimeTuesday, December 7th2:00pm - 2:45pm PST
DAC Pavilion Panels
DescriptionAs predicted by Hennessy/Patterson in 2018, the electronics industry is entering an era of domain-specific architectures and domain-specific languages that enable hyperscale computing at never-before-seen complexity, advanced edge processing, and a new breed of consumer devices. As a result, industry verticals like automotive, consumer, mobile, networking, and data center compute are re-shaping to new vertical integration and specialization levels. For example, consumer devices will deliver new user experiences at form factors and power envelopes that were hard to imagine just years ago and will exist in a hyperconnected, always-on world. In addition, hyper-convergence for infrastructure in data centers re-balances memory, storage, network, and computing at never before seen pace. This panel will discuss the resulting new sets of EDA and System Analysis requirements, including new innovative approaches for 3DIC integration, Low-Power/Thermal and Electromagnetic Analysis, and enablement for workload-optimized server and AI/ML chips and systems across data centers, networks, edges, and consumer devices. The panel will also discuss the changes in the overall supply chain for data-center silicon and system development.