A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects
TimeWednesday, December 8th4:10pm - 4:30pm PST
Event Type
Research Manuscript
Virtual Programs
Presented In-Person
Manufacturing Test and Reliability
DescriptionElectromigration (EM) has become a key reliability issue in current VLSI technology. Methodologies for analyzing EM first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, the traditional Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect tree, and develops an immortality test whose complexity is linear in the number of nodes in the tree. The proposed model is applied to a variety of interconnect structures.