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Biography
Yongpan Liu (Senior Member, IEEE) received the B.S., M.S., and Ph.D. degrees from the Department of Electronic Engineering, Tsinghua University, Beijing, China, 1999, 2002, and 2007, respectively.
He was a Visiting Scholar with Pennsylvania State University, State College, PA, USA, and the City University of Hong Kong, Hong Kong. He is currently a Professor with the Department of Electronic Engineering, Tsinghua University. He has published over 200 peer-reviewed conference and journal papers and developed several fast sleep/wakeup nonvolatile processors using emerging memory and artificial intelligent accelerators using algorithm-architecture co-optimization. His main research interests include energy-efficient circuits and systems for artificial intelligence, emerging memory devices, and Internet-of-Things (IoT) applications.
Dr. Liu’s work has received the Under 40 Young Innovators Award DAC in 2017, the Micro Top Pick in 2016, the Best Paper Award at ASPDAC 2017 and HPCA 2015, and the Design Contest Awards of ISLPED in 2012 and 2013. He served as the General Chair for AWSSS 2016 and IWCR 2018, the Technical Program Chair for NVMSA 2019, and a Program Committee Member for DAC, DATE, ASP-DAC, ISLPED, ICCD, and A-SSCC. He is an Associate Editor of IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—II: EXPRESS BRIEFS, and IET Cyber-Physical Systems: Theory and Applications.
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