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Presenter

Biography
Yang Hsu received a B.S. degree in electrical engineering and computer science from National Tsing-Hua University. He is currently pursuing the M.S. degree of the Graduate Institute of Electronics Engineering from National Taiwan University. His research interests include package routing and warpage-aware floorplanning for 2.5D IC packaging.
Presentations
Research Manuscript
EDA
Physical Design and Verification, Lithography and DFM
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