Subramanian S. Iyer received the B.Tech. degree from IIT Bombay, Mumbai, India, and the Ph.D. degree from the University of California at Los Angeles (UCLA), Los Angeles, CA, USA.
He joined the IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA, and the IBM Systems and Technology Group, Hopewell Junction, NY, USA, where he was appointed as an IBM Fellow and was, till recently, the Director of the Systems Scaling Technology Department. His key technical contributions have been in the development of the world’s first SiGe base heterojunction bipolar transistors, Salicide, electrical fuses, embedded DRAM, and 45 nm technology used at IBM and IBM’s development partners. He was among the first to commercialize bonded silicon on insulator for CMOS applications through a start-up called SiBond Ltd., a liability company. He is currently a Distinguished Chancellor’s Professor with the Electrical Engineering Department, UCLA. He has authored over 250 papers and holds over 70 patents. His current research interest include advanced packaging and 3-D integration for system-level scaling, the long- term semiconductor and packaging roadmap for logic, memory, and other devices, and hardware and supply chain integrity.
SoC, Heterogeneous, and Reconfigurable Architectures