Presenter Full Program · Contributors · Organizations · Search Program · My AgendaMore…Search ProgramMy AgendaJinwoo KimGeorgia Institute of TechnologyPresentationsResearch ManuscriptMicro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC OptionsDesignSoC, Heterogeneous, and Reconfigurable ArchitecturesPresented In-Person
