Presenter

Hui Fu is senior principal technologist in Design Enablement of Technology development group at Intel. His focus for design enablement is to leverage automation and AI/ML capabilities to accelerate DTCO (design technology co-optimization), to optimize design rules for new technology node, and to improve PDK (product design kit) quality. Prior to his current role, Hui was the design director of wireless baseband development and led intel’s last 4 generations modem SOC development. Hui had multiple R&D leadership positions with intel, Infineon and Siemens in Germany, Singapore, China, and US.