Bei Yu received the Ph.D. degree from The University of Texas at Austin in 2014. He is currently an Assistant Professor in the Department of Computer Science and Engineering, The Chinese University of Hong Kong. He has served as TPC Chair of ACM/IEEE Workshop on Machine Learning for CAD, and in many journal editorial boards and conference committees. He is Editor of IEEE TCCPS Newsletter. He received six Best Paper Awards from ICTAI 2019, Integration, the VLSI Journal in 2018, ISPD 2017, SPIE Advanced Lithography Conference 2016,ICCAD 2013, ASPDAC 2012.
Physical Design and Verification, Lithography and DFM
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