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DTSTAMP:20211208T164508Z
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DTSTART;TZID=America/Los_Angeles:20211208T153000
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UID:dac_DAC 2021_sess134@linklings.com
SUMMARY:Reliability from Fab to Mission
DESCRIPTION:Research Manuscript\n\nAs CMOS scaling continues deeper into t
 he nanometer scale and new device technologies proliferate to enhance perf
 ormance, reliability of products through their lifetime is an increasing c
 oncern. This session presents analysis and mitigation methods to prevent a
 nd detect wearout based failures for a variety of technologies, ranging fr
 om analog, digital, and mixed signal devices to memristors.\n\nLow-Cost Li
 thography Hotspot Detection with Active Entropy Sampling and Model Calibra
 tion\n\nXiao\n\nWith feature size scaling and complexity increase of circu
 it designs, hotspot detection has become a significant challenge in the ve
 ry-large-scale-integration (VLSI) industry.  In this paper, embedded in pa
 ttern sampling and hotspot detection framework, an entropy-based batch mod
 e sampling strategy ...\n\n---------------------\nReversible Gating Archit
 ecture for Rare Failure Detection of Analog and Mixed-Signal Circuits\n\nH
 u\n\nDue to the expensive simulation and manufacturing cost in analog and 
 mixed-signal (AMS) circuit design, AMS failure detection in high-dimension
 al variational space is demanding with limited samples. In this work, we p
 ropose a reversible gating architecture to identify essential features fro
 m dataset...\n\n---------------------\nEMGraph: Fast Learning-Based Electr
 omigration Analysis for Multi-Segment Interconnect Using Graph Convolution
  Networks\n\nJin\n\nElectromigration (EM) becomes a major concern for VLSI
  circuits as the technology advances in  nanometer regime. VLSI interconne
 ct can be naturally viewed as graphs. Based on this observation, we propos
 e a new graph convolution network (GCN) model, which is called EMGraph, to
  estimate transient EM s...\n\n---------------------\nA New, Computational
 ly Efficient “Blech Criterion” for Immortality in General Interconnects\n\
 nShohel\n\nElectromigration (EM) has become a key reliability issue in cur
 rent VLSI technology. Methodologies for analyzing EM first filter immortal
  wires using Blech's criterion, and then perform detailed EM analysis on t
 he remaining wires.  However, the traditional Blech's criterion was design
 ed for two-term...\n\n\nTopic: EDA\n\nKeyword: Manufacturing Test and Reli
 ability\n\nVirtual Program: Presented In-Person
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