BEGIN:VCALENDAR
VERSION:2.0
PRODID:Linklings LLC
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
X-LIC-LOCATION:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:19700308T020000
RRULE:FREQ=YEARLY;BYMONTH=3;BYDAY=2SU
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:19701101T020000
RRULE:FREQ=YEARLY;BYMONTH=11;BYDAY=1SU
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20211208T164412Z
LOCATION:Level 2 - Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20211208T170000
DTEND;TZID=America/Los_Angeles:20211208T180000
UID:dac_DAC 2021_sess251_IPPOST110@linklings.com
SUMMARY:Enhanced Hyperscaling of Data Centers using In-Chip Monitoring & S
 ensing Fabrics
DESCRIPTION:Designer, IP and Embedded Systems Track Poster Networking Rece
 ption\n\nEnhanced Hyperscaling of Data Centers using In-Chip Monitoring & 
 Sensing Fabrics\n\nMassoudi\n\nThe development of High Performance Computi
 ng (HPC) chips on a large scale for datacentre platforms poses many challe
 nges associated with multi-processor architectures working on high computa
 tional workloads. This presentation explores the interplay between thermal
  management, power distribution, processing performance and reliable servi
 ce provision at the micro level and how it can impact the decisions made w
 hen building extensive computing infrastructures. By applying key approach
 es through the deployment of embedded sensing fabrics, benefits include en
 hanced reliability of operation as well as dynamic power and speed optimis
 ation. Such schemes allow for the hyper-scaling of datacentres and create 
 new possibilities for in-field analytics.\n\nVirtual Program: Presented In
 -Person
END:VEVENT
END:VCALENDAR