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PRODID:Linklings LLC
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BEGIN:VEVENT
DTSTAMP:20211208T164406Z
LOCATION:DAC Pavilion
DTSTART;TZID=America/Los_Angeles:20211206T163000
DTEND;TZID=America/Los_Angeles:20211206T173000
UID:dac_DAC 2021_sess260_IPPOST110@linklings.com
SUMMARY:Enhanced Hyperscaling of Data Centers using In-Chip Monitoring & S
 ensing Fabrics
DESCRIPTION:Designer, IP and Embedded Systems Track Presentations\n\nEnhan
 ced Hyperscaling of Data Centers using In-Chip Monitoring & Sensing Fabric
 s\n\nMassoudi\n\nThe development of High Performance Computing (HPC) chips
  on a large scale for datacentre platforms poses many challenges associate
 d with multi-processor architectures working on high computational workloa
 ds. This presentation explores the interplay between thermal management, p
 ower distribution, processing performance and reliable service provision a
 t the micro level and how it can impact the decisions made when building e
 xtensive computing infrastructures. By applying key approaches through the
  deployment of embedded sensing fabrics, benefits include enhanced reliabi
 lity of operation as well as dynamic power and speed optimisation. Such sc
 hemes allow for the hyper-scaling of datacentres and create new possibilit
 ies for in-field analytics.\n\nVirtual Program: Presented In-Person
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